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| Published：2011.12.01 News Sources：http://www.ledccy.com Views： | ||||||
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Heat based power of LED display lamp shell size and used of places, there are different considerations. 1.aluminum heat sink, which is the most common cooling method, aluminum heat sink as part of the shell to increase heat dissipation area. 2.thermal plastic case, plastic injection molding, filling in the thermal conductivity of materials, increase the plastic shell thermal conductivity, heat capacity. 3.the surface radiation heat treatment, heat lamp shell surface of radiation treatment, a simple heat radiation paint is applied, the heat can be taken away from the lights with the way radiation shell surface. 4.air fluid dynamics, the use of light shell shape, to create a convection air, which is the lowest cost way to enhance heat dissipation. 5.fan, light shell to strengthen the internal cooling fan with long life and efficient, low cost, good effect. But want to change the fan is in trouble, and does not apply to outdoor, this design is more rare. 6.heat pipe, the use of heat pipe technology, heat conduction from the LED chip to the housing cooling fins. In large lamps, such as street lamps is a common design. 7.liquid foam ball, foam ball using liquid packaging technology, the higher the thermal conductivity of transparent liquid filled bulb in the lamp body. This is in addition to reflecting the principle, but the only use of LED display chip, a smooth thermal conductivity, heat dissipation technology. 8.the head of the use of a home-based small power LED lights, often take advantage of the internal head space, the heat of the drive circuit part or all of implantation. This can be used such as screw caps have a greater heat lamp metal surface, because the head is the close air and naval bases metal electrodes and power lines. Therefore, this part of the heat can be derived heat. 9.thermal heat integration - the use of high thermal conductivity ceramics, light shell cooling purpose is to reduce the working temperature of LED chips, LED chips as thermal expansion coefficient and we used the metal thermal conductivity, thermal expansion coefficient materials differ greatly, can not be chips of LED display soldered directly to avoid the high and low temperature thermal stress damage to LED chips. New ceramic materials with high thermal conductivity, thermal conductivity close to the aluminum, expansion coefficient can be adjusted to synchronize with the LED chip. This allows the thermal conductivity, heat integration, reduce the heat transfer between processes. |
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